Topological Soft Matter
Event description
At this moment in time, the field of topological materials is split in four distinct and isolated communities: polymer physics, synthetic chemistry, DNA nanotechnology and mesoscale metamaterials. To fully unravel the potential of topology in technological applications, we believe that these distinct communities need to be brought together to establish a common language and framework. This meeting is therefore a timely and much needed opportunity to gather leading experts in the field of topological soft materials to start breaking down the barriers between communities. By opening the dialogue between researchers doing experiments, theory and simulations, we will create fertile ground for new collaborations in this exciting emerging field bridging polymer physics, chemistry, biology and engineering.
Accommodation: please see list of suggested accommodation in Edinburgh on 'Resources' tab (bottom right)
Conference Fee: £100
Registration Deadline has been extended to 26 April 2023
Posters should be prepared in a portrait format and A0 size
Registration Now Open
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Topological Soft Matter
Venues
Edinburgh
EH9 3FD
UK
Organisers
- Yair Fosado(
- University of Edinburgh
-
Valerio Sorichetti
(
- Institute of Science and Technology, Austria
- Simon Weir(
- University of Edinburgh
Key speakers
- Erika EISER (Cambridge)
- Myfanwy EVANS (Potsdam)
- Stephen FIELDEN (Birmingham)
- Daniela KRAFT (LEI)
- David LEIGH (Manchester)
- Elisabetta MATSUMOTO (Georgia Tech)
- Cristian MICHELETTI (SISSA)
- Davide MICHIELETTO (Edinburgh)
- Nathan OLDENHUIS (University of New Hampshire)
- Rae ROBERTSON-ANDERSON (University of San Diego)
- Takahiro SAKAUE (Aoyama Gakuin University)
- Francesco SCIORTINO (Sapienza)
- Luca TUBIANA (University of Trento)
Resources
- Privacy Statement MS Word
- Accommodation MS Word
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